CYV15G0404DXB-BGXC - Infineon Technologies

Manufacturer Part Number

CYV15G0404DXB-BGXC

Manufacturer

Infineon Technologies

Introduction

The CYV15G0404DXB-BGXC is part of Infineon Technologies' HOTlink II™ series, designed to enhance telecom interface solutions.

Product Features and Performance

Delivers high-speed data transfer

Works with LVTTL interface standard

Equipped with 4 circuits

Optimized power usage between 3.135V ~ 3.465V

Supports surface mount technology

Product Advantages

Enhanced durability due to the BGA exposed pad packaging

Higher circuit integration for space savings

Key Technical Parameters

Voltage - Supply: 3.135V ~ 3.465V

Current - Supply: 900mA

Operating Temperature: 0°C ~ 70°C

Package / Case: 256-BGA Exposed Pad

Mounting Type: Surface Mount

Quality and Safety Features

Reliability under a range of thermal conditions from 0°C to 70°C

Robust construction for telecom applications

Compatibility

Optimal for systems utilizing LVTTL interfaces

Suitable for high-speed telecom and computing applications

Application Areas

Telecom systems

High-speed computing applications

Product Lifecycle

Status: Obsolete

Availability of replacements or upgrades needs to be checked with the manufacturer or suppliers

Several Key Reasons to Choose This Product

High-speed, reliable data transfer capabilities in telecom environments

Integrated circuits allow for compact system designs

Robust thermal and physical construction, ensuring longevity in demanding conditions

Obsolete status provides opportunity for cost savings if replacements or upgrades are available