Manufacturer Part Number
CYP15G0101DXB-BBXI
Manufacturer
Infineon Technologies
Introduction
CYP15G0101DXB-BBXI is a high-performance HOTlink II™ transceiver designed by Infineon Technologies for interface telecom applications. It is engineered to provide reliable high-speed data transmission through its LVTTL interface.
Product Features and Performance
High-speed data transmission capability.
LVTTL interface ensures compatibility with a range of logic families.
Operates on a supply voltage range of 3.135V to 3.465V.
Low supply current requirement of 390mA.
Capable of withstanding operating temperatures from -40°C to 85°C.
Surface mount 100-LBGA package for compact and efficient board layouts.
Engineered as part of the HOTlink II™ series, known for its robust data communication solutions.
Product Advantages
Provides reliable high-speed communication.
Flexible voltage range to accommodate various power supplies.
Low power consumption enhances overall system efficiency.
The wide temperature range makes it suitable for industrial environments.
Compact package design aids in reducing PCB space requirements.
Key Technical Parameters
Interface: LVTTL
Voltage Supply: 3.135V ~ 3.465V
Current Supply: 390mA
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 100-LBGA
Supplier Device Package: 100-TBGA (11x11)
Base Product Number: CYP15G0101
Quality and Safety Features
Built to meet high standards of quality and reliability.
The package designed for stable mounting and durability in various operating environments.
Compatibility
LVTTL interface ensures compatibility with a wide range of digital systems and logic families.
Application Areas
Designed primarily for interface telecom but suitable for high-speed data communication tasks in computing, industrial, and telecommunications sectors.
Product Lifecycle
Marked as Obsolete, indicating that it is nearing the end of its production life.
Users should consider securing additional stock for future needs or looking for replacements or upgrades.
Several Key Reasons to Choose This Product
Advanced high-speed data transmission for efficient communication.
Low power consumption, making it an energy-efficient choice.
Wide operating temperature range accommodates harsh environments.
The compact design assists in minimizing PCB space consumption.
Part of the reliable HOTlink II™ series from Infineon Technologies.
Obsolete status necessitates strategic procurement planning.
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