CY23EP05SXI-1 - Infineon Technologies

Manufacturer Part Number

CY23EP05SXI-1

Manufacturer

Infineon Technologies

Introduction

The CY23EP05SXI-1 is a high-performance clock generation and distribution device.

Product Features and Performance

Fanout Buffer and Zero Delay Buffer in one

Integrated Phase-Locked Loop (PLL)

Supports LVCMOS and LVTTL input signals

Outputs LVCMOS level signals

Operates with a single circuit

Can distribute one input to five outputs

Supports maximum frequencies of 133MHz and 167MHz

Does not include a frequency divider/multiplier

Supply Voltage range between 2.5V and 3.3V

Suitable for operation over the industrial temperature range of -40°C to 85°C

Surface-mount device in an 8-SOIC package

Product Advantages

Enables high-speed clock distribution without delay

Facilitates signal synchronization through PLL

Flexible voltage operation

Robust industrial operating temperature support

Compact and efficient design suitable for space-constrained applications

Key Technical Parameters

Input Signal Types: LVCMOS, LVTTL

Output Signal Type: LVCMOS

Input:Output Ratio: 1:5

Maximum Operating Frequency: 133MHz, 167MHz

Voltage - Supply: 2.5V to 3.3V

Operating Temperature Range: -40°C to 85°C

Mounting Type: Surface Mount

Package: 8-SOIC

Quality and Safety Features

Designed to meet industrial standards for performance and reliability

Compatibility

Compatible with LVCMOS and LVTTL signal systems

Suitable for various applications requiring precise clock distribution

Application Areas

Telecommunications

Computing systems

Consumer electronics

Networking hardware

Product Lifecycle

Status: Last Time Buy

Implication: Soon to be discontinued with limited purchasing window

Subsequent availability of replacements or upgrades should be checked with the manufacturer

Several Key Reasons to Choose This Product

High-frequency operation up to 167MHz

Integrated PLL for zero delay and synchronization

Supports common signaling standards (LVCMOS, LVTTL)

Industrial temperature range making it suitable for harsh environments

Compact SOIC package for space-efficient designs

Last chance to purchase before discontinuation adds urgency for legacy system maintenance