Manufacturer Part Number
CY2309SC-1
Manufacturer
Infineon Technologies
Introduction
The CY2309SC-1 is a clock generator from Infineon Technologies, designed to provide a zero delay buffer solution with fanout buffer distribution capabilities. The device supports various input types and is used in multiple applications requiring precise clock generation and distribution.
Product Features and Performance
Input types supported: LVCMOS, LVTTL
Output type: LVCMOS
Contains PLL with Bypass option for versatile clock management
Number of circuits: 1
Ratio Input:Output: 1:9
Frequency range up to 133.33MHz
No differential input/output
No Divider/Multiplier features
Product Advantages
Efficient clock distribution with zero delay buffer
Supports common input and output types for compatibility with various circuits
Simple ratio setup for scaling signal requirements
Key Technical Parameters
Maximum Frequency: 133.33MHz
Voltage Supply Range: 3V ~ 3.6V
Operating Temperature Range: 0°C ~ 70°C
Mounting Type: Surface Mount
Package/Case: 16-SOIC
Size specifications for integration (0.154", 3.90mm Width)
Quality and Safety Features
Complies with typical industry standards for safety and operational quality
Robust construction suitable for standard operating temperatures
Compatibility
Input types LVCMOS, LVTTL compatible
Standard output type LVCMOS
Surface mount package for use in conventional PCB manufacturing
Application Areas
Consumer Electronics
Communication Equipment
Server Applications
Product Lifecycle
Status: Obsolete
Availability of replacements or upgrades should be checked with Infineon Technologies as newer models with advanced functionalities might be available.
Several Key Reasons to Choose This Product
Provides precise clock generation and synchronization thanks to the integrated PLL with Bypass
Suitable for a wide range of applications due to versatile input and output configurations
Zero delay buffering enhances real-time performance for critical applications
Obsolete status might suggest an advantage in terms of cost for certain applications, balancing against the need to check for modern alternatives.
Easy integration into existing setups with industry-standard packaging and temperature resilience