CY2308SXC-1 - Infineon Technologies

Manufacturer Part Number

CY2308SXC-1

Manufacturer

Infineon Technologies

Introduction

The CY2308SXC-1 is a clock distribution chip designed to provide zero delay buffer and fanout capabilities.

Product Features and Performance

Fanout Buffer and Zero Delay Buffer

PLL circuit with Bypass option

Single-ended LVCMOS/LVTTL input compatible

LVCMOS level outputs

1-to-8 input-to-output ratio

Supports up to 133.3MHz frequency

Surface Mount 16-SOIC package

3V to 3.6V supply voltage range

Operational temperature range from 0°C to 70°C

Product Advantages

Precision timing control

Minimal propagation delay

Allows for extensive distribution of a single clock source

Supports common signaling standards

Enhanced signal integrity due to low jitter and skews

Robust temperature performance for a wide range of applications

Key Technical Parameters

Type: Fanout Buffer/Zero Delay Buffer

PLL: Yes (with Bypass)

Input: LVCMOS, LVTTL

Output: LVCMOS

Number of Circuits: 1

Ratio - Input:Output: 1:8

Frequency - Max: 133.3MHz

Voltage - Supply: 3V ~ 3.6V

Operating Temperature: 0°C ~ 70°C

Quality and Safety Features

Manufactured to Infineon's quality standards

Designed for reliability and long operational life

Compatibility

Compatible with LVCMOS, LVTTL input standards

Standard surface mount packaging for compatibility with common PCB designs

Application Areas

Digital electronics

Communication systems

Data processing units

Consumer electronics

Industrial timing applications

Product Lifecycle

The CY2308SXC-1 is currently Active

No immediate risk of discontinuation

Check with Infineon Technologies for potential future upgrades or replacements

Several Key Reasons to Choose This Product

Highly reliable timing solution from a reputable manufacturer

Zero delay buffer ensures synchronization of downstream components

Eight outputs from a single input reduce component count

Suitable for high-frequency applications up to 133.3MHz

Operational across a broad voltage and temperature range

Ease of design integration thanks to standard SOIC package