Manufacturer Part Number
BSP89H6327XTSA1
Manufacturer
Infineon Technologies
Introduction
Discrete Semiconductor Product
Transistors FETs, MOSFETs Single
Product Features and Performance
ROHS3 Compliant
TO-261-4, TO-261AA Package
-55°C ~ 150°C Operating Temperature
240V Drain to Source Voltage (Vdss)
±20V Vgs (Max)
6 Ohm Rds On (Max) @ 350mA, 10V
MOSFET (Metal Oxide) Technology
350mA Continuous Drain Current (Id) @ 25°C
140 pF Input Capacitance (Ciss) (Max) @ 25V
8W Power Dissipation (Max)
N-Channel FET Type
8V Vgs(th) (Max) @ 108A
5V, 10V Drive Voltage (Max Rds On, Min Rds On)
4 nC Gate Charge (Qg) (Max) @ 10V
Surface Mount Mounting Type
Product Advantages
ROHS3 Compliant
Wide Operating Temperature Range
High Voltage Capability
Low On-Resistance
High Current Handling Capability
Low Input Capacitance
High Power Dissipation
N-Channel FET Provides Efficient Switching
Key Technical Parameters
Drain to Source Voltage (Vdss): 240V
Vgs (Max): ±20V
Rds On (Max) @ Id, Vgs: 6 Ohm @ 350mA, 10V
Continuous Drain Current (Id) @ 25°C: 350mA
Input Capacitance (Ciss) (Max) @ Vds: 140 pF @ 25V
Power Dissipation (Max): 1.8W
Vgs(th) (Max) @ Id: 1.8V @ 108A
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Gate Charge (Qg) (Max) @ Vgs: 6.4 nC @ 10V
Quality and Safety Features
ROHS3 Compliant
Compatibility
Compatible with a wide range of electronic circuits and applications requiring high voltage, high current MOSFET transistors.
Application Areas
Suitable for use in a variety of electronic circuits and applications requiring high voltage, high current MOSFET transistors, such as power supplies, motor drives, and industrial electronics.
Product Lifecycle
Current product, not nearing discontinuation.
Replacement or upgrade options may be available from Infineon Technologies or other MOSFET manufacturers.
Key Reasons to Choose This Product
ROHS3 compliance for environmental responsibility
Wide operating temperature range for versatility
High voltage and current handling capabilities
Low on-resistance for efficient power delivery
Low input capacitance for fast switching
High power dissipation for thermal management
N-channel FET design for efficient switching performance