Manufacturer Part Number
BGS13S2N9E6327XTSA1
Manufacturer
Infineon Technologies
Introduction
RF switch component for high-frequency applications
Designed for wireless communication systems
Product Features and Performance
Operates in the frequency range of 100MHz to 3GHz
Supports switching operations at 3GHz test frequency
Provides 23dB of signal isolation
Delivers 0.55dB of insertion loss
Powered by 1.8V to 3.3V supply voltage
Suitable for surface mount applications
Operates within the temperature range of -40°C to 85°C
Product Advantages
Optimized for high-frequency performance
Compact surface mount package
Wide operating temperature range
Low insertion loss and high isolation
Key Technical Parameters
Frequency Range: 100MHz to 3GHz
Impedance: 50Ohm
Circuit Configuration: SP3T
Package: 9-XFLGA
Quality and Safety Features
Manufactured by Infineon Technologies, a leading semiconductor company
Meets industrial-grade quality and reliability standards
Compatibility
Suitable for use in various wireless communication systems, including 5G, LTE, and WiFi
Application Areas
RF front-end modules
Antenna switching
Wireless base stations
Portable electronics
Product Lifecycle
This product is currently in active production
Replacement or upgrade options may be available in the future
Several Key Reasons to Choose This Product
Excellent high-frequency performance with low insertion loss and high isolation
Compact surface mount package for space-constrained designs
Wide operating temperature range for versatile applications
Reliable manufacturing and quality assurance from Infineon Technologies
BGS1316ML16INF