6ED003L06F2XUMA1 - Infineon Technologies

Manufacturer Part Number

6ED003L06F2XUMA1

Manufacturer

Infineon Technologies

Introduction

The 6ED003L06F2XUMA1 is part of Infineon Technologies' EiceDriver™ series, functioning as a Power Management Integrated Circuit (PMIC) specifically designed for gate driving. This device is utilized in three-phase half-bridge configurations.

Product Features and Performance

Three-phase half-bridge driver

Drives IGBT, N-Channel, and P-Channel MOSFETs

Operating voltage range from 13V to 17.5V

High-side voltage capability up to 620V (Bootstrap)

Fast rise and fall times: 60ns and 26ns respectively

Operates in temperatures ranging from -40°C to 125°C

Surface mount technology with PG-DSO-28 packaging for robust integration

Product Advantages

Enhanced switching performance for high efficiency

Broad voltage range supports various application requirements

High thermal performance suited for elevated temperature operations

Compact 28-SOIC packaging for space-sensitive applications

Key Technical Parameters

Channel Type: 3-Phase

Voltage Supply: 13V to 17.5V

High Side Voltage Max (Bootstrap): 620V

Rise/Fall Time (Typ): 60ns / 26ns

Operating Temperature: -40°C to 125°C

Quality and Safety Features

Robust thermal management capabilities

Integrated protective features enhancing device reliability

Compliance with high industry safety standards

Compatibility

Compatible with various IGBT and MOSFET gate configurations

Suitable for integration in systems using half-bridge 3-phase layouts

Application Areas

Industrial motor drives

Power supply units

Renewable energy systems

Product Lifecycle

Status: Not For New Designs

Note: Customers should seek alternative solutions or consult Infineon for upcoming replacements or upgrades.

Several Key Reasons to Choose This Product

Versatile high and low side driving capability ensures suitability for multiple gate configurations.

Wide voltage range offers greater adaptability across different power systems.

Fast switching capabilities contribute to overall system efficiency.

High thermal and electrical reliability under extended operating conditions.

Durable and compact packaging perfect for sophisticated electronic assemblies.