HSMP-3814-TR1G - Broadcom Limited

Manufacturer Part Number

HSMP-3814-TR1G

Manufacturer

Broadcom

Introduction

The HSMP-3814-TR1G is a PIN diode designed for RF signal processing applications, known for its high performance in a compact SOT-23-3 package.

Product Features and Performance

PIN diode type with 1 Pair Common Cathode configuration

Maximum peak reverse voltage of 100V

Maximum current capacity of 1A

Low capacitance of 0.35pF at 50V and 1MHz

Low resistance of 3Ohm at 100mA and 100MHz

High operating temperature tolerance up to 150°C (TJ)

Product Advantages

High voltage and current handling capability

Low capacitance contributing to minimal signal distortion

Low series resistance for efficient signal passing

Compact SOT-23-3 packaging suitable for high-density PCB designs

Suitable for high-temperature applications

Key Technical Parameters

Voltage - Peak Reverse (Max): 100V

Current - Max: 1 A

Capacitance @ Vr, F: 0.35pF @ 50V, 1MHz

Resistance @ If, F: 3Ohm @ 100mA, 100MHz

Operating Temperature: 150°C (TJ)

Package / Case: TO-236-3, SC-59, SOT-23-3

Supplier Device Package: SOT-23-3

Quality and Safety Features

Built to withstand high voltage and current applications

Designed for operation under high-temperature conditions

Compatibility

Compatible with high-density PCB designs thanks to its compact package

Suitable for a wide range of RF processing applications with its broad operating temperature range

Application Areas

RF signal processing

High-frequency switching

Attenuator circuits

RF circuits requiring high voltage and current handling

Product Lifecycle

The product status is marked as Obsolete, indicating that it is nearing discontinuation. Users should check for replacements or upgrades from Broadcom for future projects.

Several Key Reasons to Choose This Product

High performance with minimal signal distortion due to its low capacitance and series resistance

Capability to handle high voltages and currents, making it versatile for various RF applications

Reliable operation in high-temperature environments

Compact packaging allowing for efficient use of PCB space

Given its Obsolete status, ideal for replacement in existing designs where component footprint and specifications match