MAX3209EEUU+T - Analog Devices Inc./Maxim Integrated

Manufacturer Part Number

MAX3209EEUU+T

Manufacturer

Analog Devices

Introduction

The MAX3209EEUU+T is a sophisticated RS232 transceiver from Analog Devices, designed to interface between data communication devices.

Product Features and Performance

Type: Transceiver

Protocol: RS232

Number of Drivers/Receivers: 6/10

Full duplex communication enabling simultaneous two-way data transmission

Receiver Hysteresis: 200 mV

High data rate capability: 460 Kbps

Operating temperature range from 0°C to 70°C

Surface mount technology for secure and compact installation

Product Advantages

High data integrity and noise immunity with 200 mV receiver hysteresis

Supports both high-speed communication and multiple connections with 6 drivers and 10 receivers

Compact mounting solution with 38-TFSOP packaging

Key Technical Parameters

Data Rate: 460Kbps

Voltage Supply: 10.8V ~ 13.2V

Receiver Hysteresis: 200 mV

Operating Temperature: 0°C ~ 70°C

Duplex: Full

Mounting Type: Surface Mount

Package / Case: 38-TFSOP (0.173", 4.40mm Width)

Quality and Safety Features

Rigorous quality control and dependable design for robust performance within specified operating temperatures

Compatibility

Designed for seamless functionality with devices requiring RS232 protocol

Application Areas

Suitable for a wide range of high-speed data communication applications across different sectors including telecom, data processing, and industrial control systems

Product Lifecycle

Current Status: Active

Continuously supported with no near plans for discontinuation

Upgrade paths or replacements available for future scalability

Several Key Reasons to Choose This Product

High-speed data transfer rate of up to 460Kbps for efficient operations

Enhanced reliability with built-in receiver hysteresis to combat noise

Supports complex installations with multiple drivers and receivers

Optimal operational performance guaranteed within a broad temperature spectrum (0°C ~ 70°C)

Compact and efficient surface-mounted design suitable for high-density electronic assembly