MAX3083EESD+ - Analog Devices Inc./Maxim Integrated

Manufacturer Part Number

MAX3083EESD+

Manufacturer

Analog Devices

Introduction

The MAX3083EESD+ is an advanced interface transceiver from Analog Devices, designed for RS422 and RS485 communication protocols.

Product Features and Performance

Supports RS422, RS485 protocols.

Single Driver/Receiver configuration.

Full duplex communication.

Receiver Hysteresis: 100 mV for improved noise immunity.

Data Rate capability up to 500kbps.

Operates on a supply voltage range of 4.75V to 5.25V.

Suitable for operation in temperatures from -40°C to 85°C.

Surface Mount 14-SOIC packaging for compact integration.

Product Advantages

Enhanced noise immunity due to receiver hysteresis.

High data rate support for efficient communication.

Broad operating temperature range makes it suitable for industrial environments.

Compact SOIC package for space-sensitive applications.

Key Technical Parameters

Protocol Support: RS422, RS485.

Number of Drivers/Receivers: 1/1.

Duplex: Full.

Receiver Hysteresis: 100 mV.

Data Rate: Up to 500kbps.

Supply Voltage: 4.75V to 5.25V.

Operating Temperature: -40°C to 85°C.

Package: 14-SOIC.

Quality and Safety Features

Built to meet high-quality standards of Analog Devices.

Robust construction for reliability in various environments.

Compatibility

Interoperable with RS422, RS485 protocol-based systems.

Suitable for use with standard 14-SOIC footprint.

Application Areas

Industrial control systems.

Network systems.

Communication systems.

Product Lifecycle

Status: Active.

No current indication of discontinuation, ensuring long-term availability for new designs.

Several Key Reasons to Choose This Product

High reliability and robustness for industrial applications.

Flexibility to work within RS422, RS485 communication protocols.

Enhanced noise rejection capabilities increase system stability.

Supports high-speed data transmission for efficient communication.

Operates over a broad temperature range, suitable for harsh environments.

Compact package design facilitates integration into space-restricted applications.