Manufacturer Part Number
MAX3000EEUP+T
Manufacturer
Analog Devices
Introduction
The MAX3000EEUP+T is a voltage level translator designed for bidirectional signal translation between different voltage domains.
Product Features and Performance
Voltage level translation for bidirectional communication
Supports data rates up to 230kbps
Auto-direction sensing simplifies application design
Features power-supply decoupling for stable operations
8 channels per circuit which enhances connectivity
Operates across a wide range of temperatures from -40°C to 85°C
Product Advantages
High compatibility with various voltage levels from 1.2V to 5.5V
Eases communication between devices operating at different voltage levels
Auto-direction sensing reduces design complexity
High-data rate capability suitable for rapid data transfer
Key Technical Parameters
Number of Circuits: 1
Channels per Circuit: 8
Voltage - VCCA: 1.2 V to 5.5 V
Voltage - VCCB: 1.65 V to 5.5 V
Data Rate: 230kbps
Operating Temperature: -40°C to 85°C
Quality and Safety Features
Operational over a broad temperature range ensuring reliability under varying environmental conditions
Power-supply decoupling feature mitigates power disturbances ensuring consistent performance
Compatibility
Compatible with multiple power and signal levels, enhancing usability across various electronic devices and systems
20-TSSOP package makes it suitable for surface mount technology, increasing compatibility with modern PCB designs
Application Areas
Consumer Electronics
Data Communication Systems
Portable Devices
Multimedia Applications
Product Lifecycle
Status: Active
The product is currently active with no immediate plans for discontinuation, replacements or upgrades are available if needed
Several Key Reasons to Choose This Product
Versatile voltage compatibility ensures flexibility in design application
Auto-direction sensing allows for ease of integration without complex control
Reliable data rate transition for effective communication and data transfer
Robust design suited for harsh temperature environments
Optimal package for integration into high-density electronic assemblies