Manufacturer Part Number
MAX17017GTM+
Manufacturer
Analog Devices
Introduction
The MAX17017GTM+ is a highly integrated power supply controller and monitor designed for efficient power management solutions.
Product Features and Performance
Integrated power supply controller
Versatile voltage input range of 5.5V to 28V
Capability to withstand extreme operating temperatures from -40°C to 105°C
Surface mount technology for efficient PCB design
Housed in a 48-WFQFN exposed pad package for improved heat dissipation
Provides monitoring functionality for reliable power management
Product Advantages
High integration for reduced component count and system complexity
Wide input voltage range increases compatibility with various power sources
Extended temperature range ensures reliability under harsh conditions
Compact form factor suitable for space-constrained applications
Key Technical Parameters
Applications: Power Supply Controller
Voltage Input: 5.5V ~ 28V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-WFQFN Exposed Pad
Supplier Device Package: 48-TQFN (6x6)
Base Product Number: MAX17017
Quality and Safety Features
Stringent quality control through production
Compliance with industry safety standards
Compatibility
Compatible with a wide range of input voltages
Surface mount package fits standard PCB layouts
Application Areas
Power management systems in commercial, industrial, and automotive sectors
Electronic devices requiring stable power regulation
Product Lifecycle
Product Status: Active
Not currently slated for discontinuation
Future replacement or upgrade options available through manufacturer's product line
Several Key Reasons to Choose This Product
Robust temperature tolerance ensures performance stability across environments
Wide input voltage range provides versatility in power supply design
The product is from Analog Devices, a reputable manufacturer in semiconductors and power management technologies
Active product status indicates ongoing support and availability
Compact package design allows integration into various system form factors