MAX1030BEEG+ - Analog Devices Inc./Maxim Integrated

Manufacturer Part Number

MAX1030BEEG+

Manufacturer

analog-devices

Introduction

High-Speed 10-bit ADC with Multi-Channel Inputs

Product Features and Performance

10-bit Resolution

Sampling Rate up to 300 kSPS

Multiple Input Channels: 8 Differential, 16 Single-Ended

Serial Peripheral Interface (SPI) Data Output

Sample-and-Hold Analog-to-Digital Converter (S/H-ADC)

Simultaneous Sample-and-Hold and ADC Conversion

Single ADC with Successive Approximation Register (SAR) Architecture

Selectable Internal or External Reference Voltage

Integrated Temperature Sensor

Operating Temperature from -40°C to 85°C

Product Advantages

Precision Conversion for Accurate Measurements

High Sampling Rate Suitable for Rapid Signal Acquisition

Flexible Input Configuration Supports Various Sensor Types

Low Power Consumption

Compact 24-SSOP Package for Space-Constrained Applications

Built-in temperature sensor for System Monitoring

Key Technical Parameters

10-bit Resolution

300k Samples per Second

8/16 Input Channels

Differential and Single-Ended Input Types

SPI Data Interface

1:1 Ratio S/H:ADC

External/Internal Reference Type

5V Analog Supply Voltage

5V Digital Supply Voltage

24-SSOP Packaging

Quality and Safety Features

Robust Operating Temperature Range Ensuring Reliable Performance in Variable Environments

Compliance with Industry Standards for Safety and Quality Assurance

Compatibility

SPI Protocol for Wide Compatibility with Microcontrollers and Digital Systems

Application Areas

Data Acquisition Systems

Industrial Control Systems

Medical Monitoring Devices

Portable Instrumentation

Communication Systems

Product Lifecycle

Active Status, Not Nearing Discontinuation

Availability of Replacements or Upgrades Not Specified

Reasons to Choose This Product

High-Speed Data Conversion for Real-Time Applications

Versatile Input Configuration Allowing for Various Use Cases

Integrated Features such as Temperature Sensor Add Value

Reliable Operation in Extreme Temperatures

Ease of Integration with Existing Digital Systems via SPI

Compact Form Factor Ideal for Space-Sensitive Designs