Manufacturer Part Number
DS34S132GNA2+
Manufacturer
Analog Devices
Introduction
TDM-over-Packet Controller
Product Features and Performance
Supports TDMoP (TDM over Packet)
One TDM Circuit
Dual Voltage Supply Support
Wide Operating Temperature Range
Suitable for Surface Mount Technology
Housed in a 676-BGA Package
Product Advantages
Enables Integration of Legacy TDM with Modern Packet Networks
Low Power Consumption
High Integration
Robust Temperature Performance for Industrial Applications
Key Technical Parameters
Interface Type: TDMoP
Number of Circuits: 1
Voltage - Supply: 1.8V, 3.3V
Operating Temperature Range: -40°C to 85°C
Mounting Type: Surface Mount
Package Type: 676-TEPBGA (27x27)
Quality and Safety Features
Industry-Standard Quality Compliance
High Reliability Under Varied Environmental Conditions
Compatibility
Compatible with Various TDM and Packet Networks
Application Areas
Telecommunications
Networking Infrastructure
Industrial Control Systems
Data Conversion Systems
Carrier Ethernet
Product Lifecycle
Status: Active (Contact manufacturer for any potential discontinuation or obsolescence notices)
Several Key Reasons to Choose This Product
Flexible Voltage Supply Compatibility
Suitable for Harsh Operating Environments
Streamlines Migration from TDM to Packet Networks
BGA Package for Robust, High-Density Mounting
From Trusted and Well-established Semiconductor Manufacturer Analog Devices