DS1644-120+ - Analog Devices Inc./Maxim Integrated

Manufacturer Part Number

DS1644-120+

Manufacturer

analog-devices

Introduction

The DS1644-120+ is a real-time clock (RTC) with integrated NVSRAM designed to maintain calendar time and track leap years.

Product Features and Performance

Real-time clock tracks time in hours, minutes, and seconds.

Leap Year compatibility ensures accurate date tracking during leap years.

Integrated 32KB NVSRAM for non-volatile data storage.

Parallel interface for communication and data transfer.

Calendar maintained in YY-MM-DD-dd format.

Operates on a supply voltage range of 4.5V to 5.5V.

Suitable for through-hole mounting on a 28-DIP Module.

Product Advantages

Leap Year feature ensures consistency in calendar-related applications.

32KB NVSRAM allows for ample data storage without additional components.

The parallel interface provides straightforward integration with other systems.

Key Technical Parameters

Memory Size: 32KB

Time Format: HH:MM:SS (24 hr)

Date Format: YY-MM-DD-dd

Interface: Parallel

Voltage Supply: 4.5V ~ 5.5V

Current Timekeeping (Max): 4mA at 4.5V to 5.5V

Operating Temperature: 0°C ~ 70°C

Quality and Safety Features

Designed for reliable operation within a standard temperature range.

Built according to industry standards for electronic components.

Compatibility

Compatible with systems requiring a 4.5V to 5.5V supply voltage.

Suitable for applications using a parallel interface for clock and data functions.

Application Areas

Computer systems

Industrial timing control

Time-sensitive electronic applications

Product Lifecycle

Discontinued. Currently obsolete with no direct replacements or upgrades specified.

Several Key Reasons to Choose This Product

Integration of real-time clock and 32KB non-volatile memory.

Supports leap year tracking, enhancing calendar accuracy.

Capable of operating in a moderate temperature range, making it versatile for indoor environments.

Reliable data retention facilitated by NVSRAM in the absence of a battery.

Through-hole package design simplifies board-level assembly and repair processes.