Manufacturer Part Number
5767130-5
Manufacturer
TE Connectivity (AMP)
Introduction
The TE Connectivity 5767130-5 is a high-density rectangular connector array designed for mezzanine (board-to-board) applications. It features a compact design with a 0.025" (0.64 mm) pitch, allowing for efficient use of board space in dense electronics assemblies.
Product Features and Performance
190 positions with 2 rows
025" (0.64 mm) pitch
Surface mount mounting
Board guide and ground bus (plane) features
Gold-plated contacts for reliable performance
Contact finish thickness of 30.0 µin (0.76 µm)
Supports mated stacking heights from 15.62 mm to 31.9 mm
587" (14.91 mm) height above the board
Product Advantages
High-density design for space-constrained applications
Robust construction and gold-plated contacts for long-term reliability
Multiple stacking height options to accommodate various board-to-board spacing requirements
Key Reasons to Choose This Product
Compact, high-density connector solution for efficient board space utilization
Reliable performance and long-term durability
Versatile stacking height options to suit diverse application needs
Quality and Safety Features
Gold-plated contacts for corrosion resistance and optimal electrical performance
Robust design for reliable operation in demanding environments
Compatibility
This connector is designed for mezzanine (board-to-board) applications and is compatible with corresponding receptacle and header components within the TE Connectivity MICTOR series.
Application Areas
Telecommunications and networking equipment
Industrial and automation control systems
Medical and scientific instrumentation
Aerospace and defense electronics
Product Lifecycle
The TE Connectivity 5767130-5 is an active product, and there are no plans for discontinuation at this time. TE Connectivity offers a range of alternative and equivalent models within the MICTOR series to meet various application requirements. Customers are advised to contact our website's sales team for the most up-to-date product information and availability.