Manufacturer Part Number
532436-7
Manufacturer
TE Connectivity (AMP)
Introduction
This high-density interconnect (HDI) header connector from TE Connectivity is designed for backplane applications. It features a compact, space-saving design and supports high-speed data transmission with its 200-position configuration and 0.1-inch pitch.
Product Features and Performance
200-position, 4-row high-density interconnect (HDI) header
1-inch (2.54 mm) pitch for high-density connections
Through-hole mounting for secure installation
Solder termination for reliable connections
Gold-plated contacts for superior conductivity and corrosion resistance
Mating guide features for easy and accurate mating
Operating temperature range of -65°C to 125°C
Flammability rating of UL94 V-0 for safety
Product Advantages
Compact, space-saving design for dense board-to-board or backplane connections
High-speed data transmission capabilities for demanding applications
Reliable solder termination and gold-plated contacts for long-lasting performance
Mating guide features for easy and precise connector alignment
Key Reasons to Choose This Product
Optimized for high-density backplane applications
Supports high-speed data transmission requirements
Robust construction and safety features for reliable operation
Ease of installation and mating with guide features
Quality and Safety Features
Flammability rating of UL94 V-0 for enhanced safety
Operating temperature range of -65°C to 125°C for wide environmental tolerance
Compatibility
This HDI header connector is designed for use in backplane and other high-density interconnect applications.
Application Areas
Backplane and motherboard connections
High-speed data communication systems
Industrial and commercial electronics
Product Lifecycle
The 532436-7 HDI header connector is an active product in TE Connectivity's portfolio. There are no plans for discontinuation at this time. If you have any questions or need assistance, please contact our sales team through our website.