2309407-1 - TE Connectivity AMP Connectors

Manufacturer Part Number

2309407-1

Manufacturer

TE Connectivity (TE-CONNECTIVITY-AMP)

Introduction

This TE Connectivity (TE-CONNECTIVITY-AMP) 2309407-1 SODIMM connector is a high-density, low-profile memory module socket designed for use in advanced mezzanine card (AdvancedMC) applications. It features a 25-degree angled, surface-mount design to provide a compact, space-saving solution.

Product Features and Performance

260-position SODIMM connector for DDR4 SDRAM memory

Surface-mount design with 25-degree angled orientation

Provides board guide and latching features for secure module installation

Standard top-mount configuration

Accommodates card thickness up to 1.20mm (0.047 inches)

Low overall height of 4.00mm (0.196 inches)

Black color housing

Gold-plated contacts with flash finish

Product Advantages

Compact, space-saving design for dense board layouts

Secure module retention with board guide and latching features

Supports high-speed DDR4 SDRAM memory

Key Reasons to Choose This Product

Optimized for advanced mezzanine card applications

Proven TE Connectivity reliability and quality

Facilitates the use of high-performance DDR4 memory

Easy surface-mount installation with angled orientation

Quality and Safety Features

Designed and manufactured to TE Connectivity's high standards

Compliant with relevant industry standards

Compatibility

Suitable for use with DDR4 SDRAM memory modules

Application Areas

Advanced mezzanine card (AdvancedMC) systems

Embedded computing platforms

Industrial and telecommunications equipment

Product Lifecycle

["This product is currently active and in production.","Our website's sales team offers a range of equivalent and alternative SODIMM connectors for various memory types and applications.","For more information on alternative options, please contact our website's sales team."]