Manufacturer Part Number
1565357-1
Manufacturer
TE Connectivity (TE-Connectivity-AMP)
Introduction
This is a high-density, fine-pitch rectangular connector array designed for board-to-board mezzanine applications. It features a compact and robust design with solder retention for secure and reliable connections.
Product Features and Performance
100 positions with 0.020" (0.50mm) pitch
2 rows of contacts
Surface mount mounting
Solder retention feature for secure connections
Gold-plated contacts for superior conductivity and corrosion resistance
Supports mated stacking heights of 4mm, 4.5mm, 5.5mm, and 6mm
Height above board of 0.126" (3.20mm)
Product Advantages
High-density design for space-constrained applications
Robust construction for reliable performance
Solder retention feature for secure connections
Gold-plated contacts for excellent conductivity and durability
Key Reasons to Choose This Product
Compact and high-density design for efficient board-to-board connections
Robust construction and solder retention for reliable performance
Gold-plated contacts ensure superior conductivity and corrosion resistance
Multiple mated stacking height options to accommodate various application requirements
Quality and Safety Features
Designed and manufactured to meet high-quality standards
Meets relevant industry safety and regulatory requirements
Compatibility
This connector is compatible with a wide range of PCB and system designs, making it suitable for various applications.
Application Areas
Telecommunications equipment
Industrial automation and control systems
Medical devices
Aerospace and defense electronics
Embedded systems and IoT devices
Product Lifecycle
The 1565357-1 connector is an active and currently available product. TE Connectivity offers several equivalent and alternative models with similar features and performance characteristics. Customers are advised to contact our website's sales team for more information on available options and product lifecycle details.