1554653-1 - TE Connectivity AMP Connectors

Manufacturer Part Number

1554653-1

Manufacturer

TE Connectivity

Introduction

The 1554653-1 is a high-density LGA (Land Grid Array) socket for surface mount applications. It is designed to securely hold and interconnect LGA-packaged integrated circuits or electronic components to a printed circuit board.

Product Features and Performance

2011 positions (47 x 58 grid) with a 1.0 mm pitch

Gold-plated copper alloy contacts for reliable electrical connectivity

Thermoplastic housing material for durability and high-temperature resistance

Operates in a temperature range of -25°C to 100°C

Complies with UL94 V-0 flammability rating for enhanced safety

Product Advantages

Robust and reliable design for secure component mounting

High-density configuration allows for efficient board space utilization

Gold-plated contacts provide superior conductivity and corrosion resistance

Thermoplastic housing ensures thermal and mechanical stability

Key Reasons to Choose This Product

Proven reliability and performance for critical applications

Optimized for high-density circuit board designs

Supports a wide operating temperature range

Meets safety and flammability standards for enhanced product quality

Quality and Safety Features

UL94 V-0 flammability rating for fire safety

Robust and durable construction for long-lasting performance

Compatibility

Designed for LGA-packaged integrated circuits and electronic components

Application Areas

Suitable for a wide range of industrial, telecommunications, and consumer electronics applications that require high-density interconnects

Product Lifecycle

This product is currently obsolete, meaning it is no longer in production. There may be equivalent or alternative models available from TE Connectivity or other manufacturers. Customers are advised to contact our website's sales team for more information on suitable replacement options.