TL431BIDR2 - onsemi

Manufacturer Part Number

TL431BIDR2

Manufacturer

onsemi

Introduction

The TL431BIDR2 is a shunt voltage reference IC from onsemi, offering adjustable output voltage and precise voltage regulation.

Product Features and Performance

Shunt Reference Type allows for flexible output voltage adjustment.

Adjustable Output Voltage ranging from 2.495V to 36V.

Capable of sourcing up to 100mA of output current.

High precision with a tolerance of ±0.4%.

Temperature Coefficient of 50ppm/°C, ensuring stable performance across varying temperatures.

Supports Operating Temperature range from -40°C to 85°C.

Surface Mount 8-SOIC Package for easy PCB integration.

Product Advantages

High adjustable voltage range suitable for a wide range of applications.

Precision regulation improves system accuracy and stability.

Low temperature coefficient enhances device reliability in fluctuating temperatures.

Compact 8-SOIC package allows for efficient use of PCB space.

Key Technical Parameters

Voltage Output (Min/Fixed): 2.495V

Voltage Output (Max): 36V

Current Output: 100mA

Tolerance: ±0.4%

Temperature Coefficient: 50ppm/°C

Operating Temperature: -40°C ~ 85°C

Quality and Safety Features

Designed with industry standards in mind, ensuring reliable operation and compliance with safety regulations.

Compatibility

Compatible with various power management applications requiring adjustable voltage reference in a compact package.

Application Areas

Widely used in power supplies, battery chargers, and voltage monitoring systems in consumer electronics, automotive, and industrial equipment.

Product Lifecycle

The TL431BIDR2 is marked as Obsolete, indicating that it is nearing the end of its production lifecycle. Information regarding replacements or upgrades should be sought directly from onsemi.

Several Key Reasons to Choose This Product

Wide and adjustable output voltage range for enhanced versatility.

High accuracy and stability improve overall system performance.

Suitable for a broad range of temperature conditions, enhancing device reliability.

Compact and efficient packaging facilitates easier design and manufacturing processes.

Despite being obsolete, it represents a proven solution for power management needs.