Manufacturer Part Number
TCA0372BDP1G
Manufacturer
onsemi
Introduction
Dual operational amplifier integrated circuit (IC)
Designed for instrumentation, power control, and general-purpose applications
Product Features and Performance
Dual operational amplifier in a single package
Wide supply voltage range of 5V to 40V
High output current capability of 1A per channel
Low input offset voltage of 1mV
Wide gain bandwidth product of 1.4MHz
Low input bias current of 100nA
Slew rate of 1.4V/μs
Product Advantages
Versatile dual op-amp design for various applications
Robust performance with high output current and wide voltage range
Precise and stable operation with low offset voltage and bias current
Fast response with high gain bandwidth and slew rate
Key Technical Parameters
Package: 8-PDIP (Plastic Dual Inline Package)
Operating temperature range: -40°C to +125°C
Number of circuits: 2
Gain bandwidth product: 1.4MHz
Supply voltage range: 5V to 40V
Supply current: 8mA
Slew rate: 1.4V/μs
Input offset voltage: 1mV
Input bias current: 100nA
Output current per channel: 1A
Quality and Safety Features
Robust through-hole package design for reliable operation
Wide operating temperature range for use in demanding environments
Compliance with industry standards for quality and safety
Compatibility
Widely compatible with various electronic systems and circuits
Suitable for instrumentation, power control, and general-purpose applications
Application Areas
Instrumentation and measurement equipment
Power control and conversion circuits
General-purpose amplification and buffering applications
Product Lifecycle
The TCA0372BDP1G is an active and widely available product
Replacements and upgrades may be available from onsemi or other manufacturers
Key Reasons to Choose This Product
Versatile dual op-amp design for diverse application needs
Robust performance with high output current and wide voltage range
Precise and stable operation with low offset voltage and bias current
Fast response with high gain bandwidth and slew rate
Reliable through-hole package design for demanding environments
Wide compatibility and suitability for various applications