SN74LS367AN - onsemi

Manufacturer Part Number

SN74LS367AN

Manufacturer

Texas Instruments

Introduction

The SN74LS367AN is a versatile hex buffer with non-inverting logic from Texas Instruments, specifically designed for a broad range of applications requiring buffering capabilities.

Product Features and Performance

Hex buffer, non-inverting logic

Contains two elements per package with different bit configurations (2 and 4 bits)

Three-state output type to control output presence

Supports 3-state outputs enabling shared bus techniques

Diverse high and low output current capacity (2.6mA high, 24mA low throughput)

Product Advantages

Provides flexibility through connectivity that supports multiple configurations

Three-state output reduces bus contention and improves bus efficiency

High output drive capabilities at lower power consumption

Key Technical Parameters

Logic Type: Buffer, Non-Inverting

Number of Elements: 2

Number of Bits per Element: 2, 4 (Hex)

Current Output High, Low: 2.6mA, 24mA

Voltage Supply: 4.75V ~ 5.25V

Operating Temperature: 0°C ~ 70°C

Quality and Safety Features

Reliable performance within specified temperature range

Industry standard through-hole mounting technology ensures durable and secure installation

Compatibility

Compatible with multiple supply voltages within the specified range

Through Hole Mounting type supports various PCB designs

Application Areas

Communication systems

Data processing

Consumer electronics

Industrial automation

Product Lifecycle

Currently active product status

Continued manufacturer support with no immediate discontinuation planned

Several Key Reasons to Choose This Product

Flexible connection with hex non-inverting buffer capable of handling various configurations

High current output capabilities for enhanced performance

Operates reliably within a broad temperature and voltage range

Adaptable to multiple application domains including industrial and consumer electronics

Supported by Texas Instruments, a leading manufacturer in semiconductor innovation