Manufacturer Part Number
NLV27WZ16DFT2G
Manufacturer
onsemi
Introduction
The NLV27WZ16DFT2G is a dual non-inverting buffer from onsemi's 27WZ series, designed for automotive applications with a wide voltage supply range.
Product Features and Performance
Dual non-inverting buffer
Supports 1.65V to 5.5V voltage supply
Operates in a wide temperature range: -55°C to +125°C
Automotive grade quality, meeting AEC-Q100 standards
Compatible with surface mount technology for easy PCB assembly
Push-pull output type providing reliable drive capability
Balanced output current of 32mA for both high and low states
Product Advantages
Broad compatibility with different voltage levels allows for flexible design considerations.
Capable of operating in extreme temperature conditions, ensuring reliability in automotive environments.
AEC-Q100 qualification guarantees automotive-grade reliability and performance.
Compact 6-TSSOP, SC-88, SOT-363 package saves board space in densely packed designs.
Key Technical Parameters
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Number of Bits per Element: 1
Current Output High, Low: 32mA, 32mA
Voltage Supply: 1.65V ~ 5.5V
Operating Temperature: -55°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Quality and Safety Features
AEC-Q100 qualified for high-reliability automotive applications
Robust operating temperature range ensuring performance in harsh conditions
Compatibility
Versatile voltage supply range allows for use with various electronic components.
Surface mount design is compatible with modern PCB assembly techniques.
Application Areas
Automotive systems
Industrial control circuits
Signal buffering and driving
Product Lifecycle
Status: Obsolete
Note: As this product is obsolete, consider seeking replacements or upgrades. Consult the manufacturer for alternative options.
Several Key Reasons to Choose This Product
High-reliability automotive grade product complying with stringent AEC-Q100 standards.
Flexible voltage support allowing for versatile use across different electronic designs.
Supports extreme operational temperatures, making it ideal for applications subject to harsh conditions.
Compact package design facilitates integration into space-constrained applications.
Obsolescence status necessitates a proactive approach for future-proof design, encouraging exploration of newest available technologies.