NIS1050MNTBG - onsemi

Manufacturer Part Number

NIS1050MNTBG

Manufacturer

onsemi

Introduction

The NIS1050MNTBG, manufactured by onsemi, is a specialized interface device tailored for applications in mobile communications. Designed for surface mount technology, it integrates seamlessly into various mobile communication systems.

Product Features and Performance

Tailored for mobile communication applications.

Operates across a wide voltage supply range from 3V to 30V.

Housed in a 6-WDFN Exposed Pad package for enhanced thermal performance.

Simplified mounting process due to its Surface Mount Technology (SMT) design.

Product Advantages

Wide voltage supply range enhances versatility in different mobile communication environments.

Compact 6-WDFN package allows for efficient use of space in design layouts.

Improved thermal management with the Exposed Pad design.

Designed for easy integration into mobile communications systems.

Key Technical Parameters

Voltage Supply: 3V ~ 30V

Package / Case: 6-WDFN Exposed Pad

Mounting Type: Surface Mount

Quality and Safety Features

The 6-WDFN Exposed Pad package is designed to ensure reliable operation by facilitating effective heat dissipation.

Compatibility

While specifics are not provided, compatibility is primarily geared towards mobile communications systems.

Application Areas

Specifically designed for use in the mobile communications sector.

Product Lifecycle

The product status is marked as Obsolete, indicating it might be nearing discontinuation. Customers are advised to check for replacements or upgrades.

Several Key Reasons to Choose This Product

Broad operational voltage range (3V to 30V) adds flexibility to the power design of mobile communication systems.

Compact and efficient packaging supports space-saving designs and enhanced thermal management.

Designed specifically for seamless integration into mobile communications technology.

The obsolescence status signals a need for customers to consider long-term replacements or upgrades, potentially allowing for integration of newer technologies.