NB3N51034DTR2G - onsemi

Manufacturer Part Number

NB3N51034DTR2G

Manufacturer

onsemi

Introduction

High-precision clock generator for timing applications.

Product Features and Performance

PLL (Phase-Locked Loop) enabled

Supports Clock and Crystal inputs

Provides HCSL (High-Speed Current Steering Logic) and LVDS (Low Voltage Differential Signaling) outputs

Single integrated circuit with a 1:4 input to output ratio

Supports differential signaling on output

Capable of frequency output up to 200MHz

Includes divider but no multiplier functionality

Designed for supply voltages between 3.135V and 3.465V

Operational across a temperature range of -40°C to 85°C

Product Advantages

High integration reduces component count

Support for high-speed signaling protocols (HCSL and LVDS)

Wide operating temperature range for industrial applications

Flexible power supply requirements to fit various design needs

Key Technical Parameters

Max Frequency: 200MHz

Input:Output Ratio: 1:4

Voltage - Supply Range: 3.135V ~ 3.465V

Operating Temperature Range: -40°C ~ 85°C

Mounting Type: Surface Mount

Package / Case: 20-TSSOP

Quality and Safety Features

Built to industrial standards for operating temperature and voltage

Surface mount package designed for robust PCB integration

Compatibility

Suitable for various digital high-speed applications requiring clock or crystal input

Compatible with devices demanding HCSL or LVDS outputs

Application Areas

Network infrastructure

Data communication equipment

High-speed computing

Industrial timing solutions

Telecommunication systems

Product Lifecycle

Active status

No current indication of discontinuation

Replacement or upgrade options may be provided by onsemi as per industry standards

Several Key Reasons to Choose This Product

Efficiency in managing high-speed data with 200MHz max frequency

Robust temperature and voltage operating ranges

Differential signaling for improved signal integrity

Compatibility with high-speed protocols (HCSL and LVDS)

Ease of integration with common surface mount processes

Availability of parts in Tape & Reel packaging for automated assembly