NB2305AI1DR2G - onsemi

Manufacturer Part Number

NB2305AI1DR2G

Manufacturer

onsemi

Introduction

The NB2305AI1DR2G is a zero-delay buffer from onsemi's clock/timing product category.

Product Features and Performance

Zero Delay Buffer

Phase-Locked Loop (PLL) for frequency synchronization

Single CMOS input to CMOS output configuration

Support for up to 5 output clocks from a single input

Maximum operating frequency of 133MHz

Designed for low jitter and high clock accuracy

Operates within a supply voltage range of 3V to 3.6V

Supports a wide operating temperature range from -40°C to 85°C

Surface Mount 8-SOIC package for compact PCB integration

Product Advantages

Precise clock distribution with zero delay

Direct compatibility with CMOS logic levels

Ability to generate multiple synchronized outputs from a single input

Robust operation under extreme temperature conditions

Key Technical Parameters

Type: Zero Delay Buffer

PLL: Yes

Input: CMOS

Output: CMOS

Number of Circuits: 1

Ratio - Input:Output: 1:5

Differential - Input:Output: No/No

Frequency - Max: 133MHz

Divider/Multiplier: No/No

Voltage - Supply: 3V ~ 3.6V

Operating Temperature: -40°C ~ 85°C

Mounting Type: Surface Mount

Package / Case: 8-SOIC

Supplier Device Package: 8-SOIC

Base Product Number: NB2305

Quality and Safety Features

Conforms to industry standards for performance stability and reliability

Suitable for high-temperature environments with strict thermal requirements

Compatibility

Direct CMOS level interfacing compatible across a variety of digital systems

Application Areas

Ideal for applications necessitating precise clock management like digital electronics, embedded systems, and communication devices

Product Lifecycle

Obsolete - No longer in production

Alternatives or upgrade paths may be offered by the manufacturer

Several Key Reasons to Choose This Product

Enhances system reliability with exact clock timing

Facilitates clock distribution without signal degradation

Helps to maintain signal integrity over varying temperatures

Ease of design integration due to surface mount packaging

Legacy support for systems requiring discontinued components