Manufacturer Part Number
MC74HCU04ADR2G
Manufacturer
onsemi
Introduction
MC74HCU04ADR2G is a Hex Unbuffered Inverter belonging to the 74HCU series.
Product Features and Performance
6 inverter circuits in one package
Unbuffered output
Wide operating voltage range of 2V to 6V
Low quiescent current of 1 µA
Symmetrical output impedance
High noise immunity
Product Advantages
High functionality with multiple inverters in one package
Lower power consumption with minimal quiescent current
Operational in a broad range of supply voltages
Robust performance with high noise immunity
Key Technical Parameters
Logic Type: Inverter
Number of Circuits: 6
Inputs per Circuit: 1
Voltage - Supply: 2V to 6V
Current - Quiescent: Maximum 1 µA
Current - Output High, Low: 5.2mA
Low-Level Input Voltage: 0.3V to 1.1V
High-Level Input Voltage: 1.7V to 4.8V
Propagation Delay Max: 12ns at 6V, 50pF load
Operating Temperature Range: -55°C to 125°C
Mounting Type: Surface Mount
Device Package: 14-SOIC
Case Style: 14-SOIC
Quality and Safety Features
Conforms with onsemi's quality standards for Logic Gates and Inverters
Safe operating temperature range from -55°C to 125°C
Compatibility
Compatible with other logic families with appropriate power supply voltage
Adequate for surface mount technology (SMT) on various substrates
Application Areas
Consumer electronics
Telecommunications
Automotive systems
Embedded processors and controllers
Product Lifecycle
Product Status: Active
Not indicated as near discontinuation
Replacements or upgrades should be sourced from 74HCU series as needed
Reasons to Choose This Product
Versatile logic inverter functionality in a compact form factor
Power-efficient for designs requiring low quiescent current
Compatibility with a wide operating voltage range offering flexibility in system design
High noise immunity suitable for challenging electrical environments
Extended temperature range supporting usage in diverse applications
Part of a long-established and reliable series (74HCU) from onsemi
Readily available in Tape & Reel packaging for efficient assembly processes
Comprehensive technical parameters for precise design integration