MC14067BDWG - onsemi

Manufacturer Part Number

MC14067BDWG

Manufacturer

onsemi

Introduction

The MC14067BDWG is an analog switch/multiplexer-demultiplexer designed for various interface applications, providing robust performance with a 16:1 multiplexer/demultiplexer circuit.

Product Features and Performance

16:1 multiplexer/demultiplexer circuit

Single 3V to 18V supply operation

280 Ohm maximum on-state resistance

10 Ohm channel-to-channel matching

15MHz -3db bandwidth

100pF channel capacitance when off

100nA maximum leakage current

Operational temperature range from -55°C to 125°C

Product Advantages

High flexibility with single supply operation ranging from 3V to 18V

Optimal signal integrity maintained with low on-state resistance and channel-to-channel matching

Suitable for high-frequency applications up to 15MHz

Low power consumption with minimal leakage current

Key Technical Parameters

Multiplexer/Demultiplexer Circuit: 16:1

On-State Resistance (Max): 280 Ohm

Channel-to-Channel Matching (ΔRon): 10 Ohm

Voltage - Supply, Single (V+): 3V ~ 18V

Channel Capacitance (CS(off), CD(off)): 100pF

Current - Leakage (IS(off)) (Max): 100nA

Operating Temperature: -55°C ~ 125°C

Quality and Safety Features

Guaranteed performance across wide operating temperature range from -55°C to 125°C

High precision and reliability with rigorous quality control standards

Compatibility

Surface mount device packaged in a 24-SOIC ensuring compatibility with standard mounting processes

Application Areas

Telecommunications

Data acquisition systems

Test equipment

Consumer electronics

Product Lifecycle

Product Status: Active

This product is actively manufactured with no indication of discontinuation, ensuring long-term availability and support.

Several Key Reasons to Choose This Product

Versatile supply operation from 3V to 18V enabling use in various circuit environments

Optimal for high-performance applications with high bandwidth and low on-state resistance

Reliable operation guaranteed in extreme conditions ranging from -55°C to 125°C

Low power consumption with minimal leakage simplifying power management in complex systems

High compatibility with standard surface mount processes simplifying assembly and integration into existing designs