MC100LVE111FNR2G - onsemi

Manufacturer Part Number

MC100LVE111FNR2G

Manufacturer

onsemi

Introduction

The MC100LVE111FNR2G is a high-speed 1:9 fanout buffer designed to distribute ECL and PECL clock signals.

Product Features and Performance

Distributes one ECL/PECL input to nine ECL/PECL outputs

Maximum frequency of 1.5 GHz for high-speed applications

Compatible with ECL and PECL signal standards

Supports supply voltages between 3V and 3.8V

Operates across a temperature range of -40°C to 85°C

Available in a 28-LCC (J-Lead) surface mount package

Product Advantages

High fanout capability facilitates distribution of clock signals in complex systems

High frequency support is ideal for demanding applications

Broad compatibility with ECL and PECL logic families

Suitable for harsh environments due to its wide operating temperature range

Key Technical Parameters

Type: Fanout Buffer (Distribution)

Number of Circuits: 1

Ratio Input:Output: 1:9

Differential Input:Output: Yes/Yes

Input: ECL, PECL

Output: ECL, PECL

Frequency Max: 1.5 GHz

Voltage Supply: 3V ~ 3.8V

Operating Temperature: -40°C ~ 85°C

Mounting Type: Surface Mount

Package / Case: 28-LCC (J-Lead)

Supplier Device Package: 28-PLCC (11.51x11.51)

Quality and Safety Features

The product is built to meet stringent quality and performance standards.

Compatibility

Designed for systems utilizing ECL and PECL timing signals.

Application Areas

Ideal for high-speed communication, networking, and computing systems where signal distribution is critical.

Product Lifecycle

Obsolete - consult the manufacturer for potential replacement and upgrade options.

Several Key Reasons to Choose This Product

The onsemi brand ensures rigorous quality and reliability standards

High-speed performance with up to 1.5 GHz operation is ideal for advanced applications

The 1:9 fanout ratio allows for efficient distribution of clock signals within electronic systems

The product's versatility in accepting both ECL and PECL signals offers design flexibility

Support for a wide range of operating temperatures enables use in various environmental conditions

Surface mount package allows for compact PCB design and manufacturing efficiency