MC100EPT25DTG - onsemi

Manufacturer Part Number

MC100EPT25DTG

Manufacturer

onsemi

Introduction

The MC100EPT25DTG is a logic translator device designed for interfacing between ECL (Emitter Coupled Logic) and LVTTL (Low Voltage TTL) signal levels.

Product Features and Performance

Unidirectional data flow

Supports ECL to LVTTL signal translation

Designed for use in mixed signal applications

High-speed data processing capabilities

Operates efficiently within industrial temperature ranges

Product Advantages

Allows for seamless communication between different logic families

Enhances system flexibility by enabling cross-logic interfacing

Reduces signal distortion through effective level translation

Improves system reliability in mixed signal environments

Key Technical Parameters

Translator Type: Mixed Signal

Channel Type: Unidirectional

Number of Circuits: 1

Channels per Circuit: 1

Input Signal: ECL

Output Signal: LVTTL

Output Type: Non-Inverted

Operating Temperature: -40°C ~ 85°C

Quality and Safety Features

Built to operate reliably in a wide range of temperatures

Complies with industry standard safety and quality regulations

Ensures signal integrity and consistent performance

Compatibility

Compatible with various ECL and LVTTL integrated circuits

Can be implemented in systems utilizing 8-TSSOP surface mount packaging

Application Areas

Telecommunications

Data communication systems

Signal processing units

High-speed computing interfaces

Product Lifecycle

Product Status: Active

Not currently nearing discontinuation

Replacements or upgrades may be available as technology advances

Several Key Reasons to Choose This Product

Designed for high-speed logic level translation

Facilitates integration of ECL and LVTTL components within a single system

Robust performance in extended temperature environments

High-reliability component from a reputable manufacturer, onsemi

Offers design versatility due to its unidirectional data transfer capability

Comes in a small form factor 8-TSSOP package, optimizing board space