Manufacturer Part Number
MC100EP52DR2G
Manufacturer
onsemi
Introduction
High-speed D-type flip-flop logic device designed for fast communication and computation applications.
Product Features and Performance
Logic Flip Flops Category
Tape & Reel Packaging for automation compatibility
100EP Series high-performance devices
Standard Function D-Type Flip Flop
Complementary Output Type for differential signaling
Single Element with 1 Bit per Element
High Clock Frequency of 3 GHz for rapid processing
Dual Trigger Type, works with both Positive and Negative edges
Suitable Operating Temperature from -40°C to 85°C
Surface Mount Technology for PCB assembly
Product Advantages
Advanced high-speed design suitable for fast digital circuits
Robust temperature range for varied environmental conditions
Complementary outputs provide versatility in circuit designs
Positive and Negative edge triggering for flexible circuit integration
Key Technical Parameters
3 GHz Clock Frequency
45 mA Quiescent Current
-3V to -5.5V Supply Voltage range
8-SOIC Supplier Device Package
8-SOIC 0.154" width Package/Case
Quality and Safety Features
Built to operate reliably within rated temperature and power specifications
Manufactured with industry-standard quality and safety protocols
Compatibility
Compatible with other high-speed logic interfaces
Adaptable to various digital electronic systems needing high-frequency flip-flop functionality
Application Areas
High-speed digital circuits
Telecommunication systems
Computing devices
Data processing equipment
Precision instrumentation
Product Lifecycle
Active Product Status indicating current production and availability
Information on discontinuation or replacements is typically provided by the manufacturer
Several Key Reasons to Choose This Product
Ultra-fast 3 GHz performance for advanced digital systems
Wide operating temperature range ensuring reliability in extreme conditions
Dual-edge triggering enhancing circuit design flexibility
Onsemi's reputation for durable and consistent high-quality electronic components
Device and packaging designed for easy integration with modern surface mount technology production lines