FXLA108BQX - onsemi

Manufacturer Part Number

FXLA108BQX

Manufacturer

onsemi

Introduction

The FXLA108BQX is a voltage level translator from Onsemi designed for bidirectional signal translation between two logic levels. It is housed in a 20-WFQFN exposed pad package and is optimized for high-speed data transmission.

Product Features and Performance

Bidirectional voltage level translation between 1.1 V and 3.6 V

Supports 8 channels for efficient data handling

High data rate capability up to 140Mbps for fast data transfer

Auto-Direction Sensing for seamless signal direction detection

Power-Off Protection to safeguard against data loss during power transitions

Product Advantages

High-speed communication support enhances system throughput

Auto-direction sensing simplifies design and reduces system complexity

Power-off protection ensures reliability and data integrity

Compact 20-DQFN package saves board space

Key Technical Parameters

Voltage VCCA: 1.1 V ~ 3.6 V

Voltage VCCB: 1.1 V ~ 3.6 V

Channels per Circuit: 8

Data Rate: 140Mbps

Operating Temperature: -40°C ~ 85°C (TA)

Quality and Safety Features

Designed with safety and reliability in mind, ensuring stable operation across various environmental conditions.

Compatibility

Compatible with a wide range of supply voltages, facilitating integration into diverse system architectures.

Application Areas

Ideal for applications requiring high-speed data transmission and voltage level translation, such as mobile devices, computing interfaces, and communication systems.

Product Lifecycle

The product status is Active, indicating ongoing production and support. Not currently nearing discontinuation, with onsemi committed to long-term availability and support.

Several Key Reasons to Choose This Product

High-speed data transfer capability makes it suitable for bandwidth-intensive applications

Auto-direction sensing and power-off protection feature add to system reliability

Broad compatibility with various logic levels for flexible design options

Active product status ensures long-term availability and support

Compact package design allows for efficient use of PCB space