Manufacturer Part Number
FSA839UCX
Manufacturer
onsemi
Introduction
The FSA839UCX is a high-performance analog switch from onsemi, designed for multiplexer and demultiplexer applications with a single-pole double-throw (SPDT) configuration.
Product Features and Performance
Single (1:2) multiplexer/demultiplexer circuit
On-State Resistance: Maximum 750mOhm
Operating Voltage Range: 1.65V to 5.5V
Fast Switching Time: 25ns on, 20ns off
High Bandwidth: 60MHz
Low Charge Injection: 70pC
Low Channel Capacitance: 50pF
Ultra-Low Leakage Current: 10nA
Excellent Crosstalk Damping: -55dB at 1MHz
Minimum Operating Temperature: -40°C
Maximum Operating Temperature: 85°C
Product Advantages
Wide Voltage Range Supports Various Applications
High-Speed Switching Suitable for Fast Signal Routing
Low Power Draw Enhances Battery Life in Portable Devices
Minimal Signal Distortion Ensures High Signal Integrity
Compact 6-WLCSP Package Ideal for Space-Constrained Applications
Key Technical Parameters
SPDT Switch Circuit
2:1 Multiplexer/Demultiplexer
750mOhm Max On-State Resistance
Voltage Supply: 1.65V to 5.5V
Switch Time (Max): 25ns On, 20ns Off
-3dB Bandwidth: 60MHz
Channel Capacitance: 50pF
Leakage Current (Max): 10nA
Quality and Safety Features
Robust Operating Temperature Range from -40°C to 85°C
Excellent Crosstalk Immunity at High Frequencies
Compatibility
Suitable for applications requiring voltage levels between 1.65V and 5.5V
Application Areas
Consumer Electronics
Telecom Infrastructure
Data Acquisition Systems
Medical Instrumentation
Product Lifecycle
Obsolete Product
Customers should seek replacements or upgrades
Several Key Reasons to Choose This Product
High Bandwidth and Fast Switching Capabilities Enable Efficient Signal Routing
Low Charge Injection and Channel Capacitance Ensure Minimal Signal Loss
Wide Operating Voltage Range Makes It Versatile Across Different Applications
Ultra-Low Leakage Current Limits Power Waste, Enhancing Device Efficiency in Power-Sensitive Applications
Compact and Efficient Packaging Suitable for Modern High-Density Electronic Assemblies