FSA5157L6X - onsemi

Manufacturer Part Number

FSA5157L6X

Manufacturer

onsemi

Introduction

The FSA5157L6X is an SPDT analog switch designed for 2:1 multiplexing/demultiplexing applications, available in a compact 6-UFDFN package.

Product Features and Performance

Single Pole Double Throw (SPDT) configuration

2:1 Multiplexer/Demultiplexer Circuit

Low on-state resistance of 360mOhm (typical)

Channel-to-Channel Matching (ΔRon) of 40mOhm

Supports 1.65V to 4.3V supply voltage range

Fast switching times: 55ns (Ton), 30ns (Toff)

High bandwidth performance at -3dB, 80MHz

Charge Injection limited to 6pC

Channel Capacitance: 21pF (CS(off), CD(off))

Minimal current leakage: Maximum 10nA (IS(off))

Excellent crosstalk performance: -75dB at 100kHz

Operating Temperature range: -40°C to 85°C

Product Advantages

High performance in signal integrity

Low power consumption

Suitable for battery-powered applications

Low signal distortion

Excellent for high-speed applications

Compact, space-saving package

Key Technical Parameters

On-State Resistance (Max): 360mOhm

Voltage Supply, Single (V+): 1.65V to 4.3V

Switch Time (Ton, Toff) (Max): 55ns, 30ns

Bandwidth: -3db 80MHz

Operating Temperature: -40°C to 85°C

Package: 6-UFDFN

Quality and Safety Features

Rigorous product testing ensures reliability and durability

Designed in compliance with industry safety standards

Compatibility

Broad voltage compatibility, ranging from low to mid-range supply levels

Versatile for integration into numerous electronic systems

Application Areas

Mobile Devices

Portable Electronics

Audio and Video Signal Routing

Data Acquisition Systems

Communication Devices

Product Lifecycle

Current status: Active

No indication of nearing discontinuation, ensuring long-term availability

Several Key Reasons to Choose This Product

Precision performance with low on-state resistance

Fast switch times accommodating rapid signal routing

High bandwidth suitable for video and high-speed data

Low power dissipation to extend battery life in portable applications

Resilient across a wide temperature range suitable for harsh environments

Compact size for high-density electronic assemblies