74AC32SC - onsemi

Manufacturer Part Number

74AC32SC

Manufacturer

onsemi

Introduction

The 74AC32SC from onsemi is an OR Gate logic IC, part of the 74AC series designed for high-speed logic operations in computing and digital systems.

Product Features and Performance

Quad 2-input OR Gate

Operates from 2V to 6V supply

Low quiescent current of 2 µA maximum

High output current of 24mA (both high and low levels)

Supports input logic levels from 0.9V for low and 2.1V for high

Fast propagation delay of 7.5ns at 5V supply and 50pF load

Designed for surface mount technology with a 14-SOIC package

Product Advantages

Versatile power supply range accommodating various logic systems

Ultra-low power consumption for energy-efficient designs

Strong drive capability allowing for multiple outputs to be driven

High-speed operation suitable for fast logic circuits

Compact surface mount package facilitating space-saving PCB designs

Key Technical Parameters

Supply Voltage: 2V ~ 6V

Quiescent Current: 2 µA (Max)

Output Current: 24mA (High and Low)

Input Logic Level Low: 0.9V ~ 1.65V

Input Logic Level High: 2.1V ~ 3.85V

Max Propagation Delay: 7.5ns @ 5V, 50pF

Operating Temperature: -40°C ~ 85°C

Mounting Type: Surface Mount

Quality and Safety Features

Manufactured under strict standards for quality and reliability

Compatibility

Compatible with a wide range of digital logic families due to its variable supply voltage feature

Application Areas

Digital computing systems

Data processing circuits

High-speed logic circuits

Consumer electronics

Product Lifecycle

The product status is obsolete, indicating that it is nearing discontinuation. Customers are advised to check for replacement or upgrade options.

Several Key Reasons to Choose This Product

High versatility due to its wide operating voltage range

Energy-efficient operation with ultra-low quiescent current

Robust output driving capability enhancing circuit reliability

Fast operation enabling high-speed digital logic designs

Compact and reliable SOIC packaging for space-constrained applications