Manufacturer Part Number
XCVU9P-3FLGA2104E
Manufacturer
AMD Xilinx
Introduction
High-performance, Scalable FPGA with Advanced Capabilities
Product Features and Performance
Integrated 16nm FinFET+ UltraScale+ FPGA Fabric
2,586,150 Logic Cells
391,168,000 Total RAM Bits
147,780 Configurable Logic Blocks (CLBs)
832 User I/O Pins
High-speed Transceivers up to 58.2 Gbps
Advanced DSP Capabilities
Integrated PCIe Gen3/Gen4 Blocks
Robust Security Features
Product Advantages
Unparalleled Performance and Capacity
Flexible, Scalable Architecture
Advanced Connectivity and Processing Features
Comprehensive Security Suite
Key Technical Parameters
Package: 2104-FCBGA (47.5x47.5)
Mounting Type: Surface Mount
Operating Temperature: 0°C to 100°C (TJ)
Supply Voltage: 0.873V to 0.927V
Quality and Safety Features
RoHS3 Compliant
Rigorous Quality Assurance Processes
Compatibility
Compatible with AMD Xilinx UltraScale+ FPGA Design Tools and Ecosystem
Application Areas
High-performance Computing
Aerospace and Defense
5G and Networking
Automotive
Industrial Automation
Product Lifecycle
Currently in active production
Replacement or upgrade options available from AMD Xilinx
Key Reasons to Choose This Product
Unmatched performance and capacity for demanding applications
Flexible, scalable architecture to meet evolving requirements
Comprehensive suite of advanced features and capabilities
Robust security features to protect critical systems
Compatibility with the extensive AMD Xilinx FPGA ecosystem
XCVU57P-2FSVK2892EAMDIC FPGA VIRTEX-UP 2892BGA