Manufacturer Part Number
XCVU9P-1FLGA2104E
Manufacturer
Xilinx
Introduction
High-capacity, high-performance Virtex UltraScale+ FPGA for advanced applications
Product Features and Performance
Massive programmable logic with 2,586,150 logic cells
High memory capacity with 391,168,000 total RAM bits
Large number of I/O pins reaching up to 832
Surface mount, 2104-pin flip-chip BGA package for robust integration
Supports high-speed applications with a supply voltage ranging from 0.825V to 0.876V
Suitable for high-temperature operations, from 0°C to 100°C
Product Advantages
Suitable for complex and compute-intensive applications
Enables high-speed signal processing and data throughput
Offers high integration to reduce board space and component count
Supports advanced design techniques with its high logic and memory capacity
Key Technical Parameters
Number of LABs/CLBs: 147,780
Number of Logic Elements/Cells: 2,586,150
Total RAM Bits: 391,168,000
Number of I/O: 832
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Quality and Safety Features
Complies with stringent quality standards for FPGAs
Designed for reliable operation in a broad temperature range
Compatibility
Compatible with Virtex UltraScale+ series design ecosystems and tools
Integrates with various system architectures due to high I/O count
Application Areas
High-performance computing
Data center acceleration
Wired communications
Aerospace and defense systems
Medical imaging
Product Lifecycle
Active product status, not nearing discontinuation
Future upgrades and replacements available as part of the Virtex UltraScale+ series
Several Key Reasons to Choose This Product
Industry-leading performance for advanced applications
High logic and memory density for demanding processing tasks
Versatility in high-speed computing and signal processing applications
Reliability in extreme temperature conditions for harsh environments
Backward compatible within the Virtex series, enabling design scalability
