Manufacturer Part Number
XCVU19P-2FSVB3824E
Manufacturer
Xilinx
Introduction
High-performance FPGA for demanding applications
Product Features and Performance
Embedded FPGA from Virtex® UltraScale+™ series
High logic capacity with 8,937,600 logic elements
Large number of LABs/CLBs: 510,720
Vast total RAM bits: 79,586,918
Extensive I/O options with 1760 available I/O pins
Product Advantages
Designed for advanced embedded systems
Supports extensive logic and memory operations
High I/O count enabling versatile connectivity
Robust thermal performance with a 0°C to 100°C operating temperature range
Key Technical Parameters
Number of LABs/CLBs: 510720
Number of Logic Elements/Cells: 8937600
Total RAM Bits: 79586918
Number of I/O: 1760
Voltage Supply Range: 0.825V to 0.876V
Mounting Type: Surface Mount
Operating Temperature Range: 0°C to 100°C (TJ)
Package/Case: 3824-BBGA, FCBGA
Supplier Device Package: 3824-FCBGA (65x65)
Quality and Safety Features
Rigorous quality control standards
Thermal and electrical safety compliant
Compatibility
Compatible with various surface mount technologies
Integratable with numerous existing designs and systems
Application Areas
Data centers
High-performance computing
Telecommunications
Aerospace and defense applications
Medical imaging systems
Broadcast, video, and multimedia
Product Lifecycle
Currently active product status
Not nearing discontinuation
Availability of replacements or upgrades monitored by Xilinx
Several Key Reasons to Choose This Product
Ultra-high logic and memory capabilities for complex computations
High I/O pin count for flexible system design
Reliable operating temperature ensuring performance in extreme conditions
Part of the cutting-edge Virtex® UltraScale+™ FPGA series
Broad application range ensuring versatility
Xilinx quality and support for long-term reliability