XCV812E-6BG560C - AMD

Manufacturer Part Number

XCV812E-6BG560C

Manufacturer

Xilinx

Introduction

The XCV812E-6BG560C is part of the Virtex-E EM series, an advanced embedding FPGA product offering robust features for high-performance applications.

Product Features and Performance

Embedded FPGA from Virtex-E EM series

4704 LABs/CLBs for flexible logic implementation

21168 Logic Elements/Cells for complex circuit design

Total RAM Bits of 1146880 for high memory applications

404 I/O pins for extensive peripheral interfacing

254016 Gates for considerable design capability

Supports 1.71V ~ 1.89V supply voltages for low-power operation

Surface Mount technology compatible for modern PCB design

560-LBGA Exposed Pad, Metal package for efficient heat dissipation

Operating temperature range from 0°C to 85°C, suitable for various environments

Product Advantages

High logic capacity and gate density for complex designs

A large amount of embedded RAM for memory-intensive applications

Wide range of I/O options facilitates integration in multiple systems

Advanced power management with low-voltage support

Industry-standard surface mount packaging for secure PCB mounting

Key Technical Parameters

Number of LABs/CLBs: 4704

Number of Logic Elements/Cells: 21168

Total RAM Bits: 1146880

Number of I/O: 404

Number of Gates: 254016

Voltage - Supply: 1.71V ~ 1.89V

Mounting Type: Surface Mount

Operating Temperature: 0°C ~ 85°C

Package / Case: 560-LBGA Exposed Pad, Metal

Supplier Device Package: 560-MBGA (42.5x42.5)

Quality and Safety Features

High-quality Ball Grid Array (BGA) packaging ensures reliable solder joints and stability

Designed for a wide operating temperature range, ensuring performance under thermal stress

Compatibility

Compatible with other Virtex-E EM series products for system integration and upgrades

Designed for use with industry-standard power supplies and surface mount technology

Application Areas

High-performance computing

Telecommunications

Networking equipment

Industrial applications requiring complex programmable logic

Product Lifecycle

Obsolete status, check for end-of-life notifications

Availability of replacements or upgrades to newer FPGA series or technologies may be limited

Several Key Reasons to Choose This Product

High-capacity FPGA suited for advanced embedded systems

Comprehensive feature set enables versatile use across industries

Durable and reliable for long-lasting performance in harsh conditions

Leverages Xilinx's reputation for leading-edge programmable logic solutions

Advanced technical specifications match the needs for demanding applications