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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XCV1000-5BG560C
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XCV1000-5BG560C - AMD

Manufacturer Part Number
XCV1000-5BG560C
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XCV1000-5BG560C
ECAD Model
Parts Description
IC FPGA 404 I/O 560MBGA
Detailed Description
Package
560-LBGA Exposed Pad, Metal
Data sheet
Virtex 2.5 V.pdf
Our certification
In stock: 4560

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Specifications

XCV1000-5BG560C Tech Specifications
AMD - XCV1000-5BG560C technical specifications, attributes, parameters and parts with similar specifications to AMD - XCV1000-5BG560C

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Voltage - Supply 2.375V ~ 2.625V  
Total RAM Bits 131072  
Supplier Device Package 560-MBGA (42.5x42.5)  
Series Virtex®  
Package / Case 560-LBGA Exposed Pad, Metal  
Package Tray  
Product Attribute Attribute Value  
Operating Temperature 0°C ~ 85°C (TJ)  
Number of Logic Elements/Cells 27648  
Number of LABs/CLBs 6144  
Number of I/O 404  
Number of Gates 1124022  
Mounting Type Surface Mount  
Base Product Number XCV1000  

Parts Introduction

Manufacturer Part Number

XCV1000-5BG560C

Manufacturer

Xilinx

Introduction

The XCV1000-5BG560C is a high-capacity FPGA device from Xilinx's Virtex® series, designed for advanced embedded systems applications requiring high-performance logic operations, substantial logic elements, and RAM resources. Targeted at demanding applications, this device offers a flexible and programmable solution in a surface-mount package.

Product Features and Performance

High-density FPGA with 1,124,022 gates

Contains 6,144 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs)

Features 27,648 Logic Elements/Cells for versatile programming

Offers 131,072 total RAM bits for high-capacity memory storage

Supports 404 I/O pins for extensive peripheral integration

Operates on a 2.375V to 2.625V supply voltage for energy efficiency

Surface Mount, 560-LBGA Exposed Pad, Metal package for robust mounting

Can operate within a temperature range of 0°C to 85°C (TJ), ensuring reliability under varying environmental conditions

Product Advantages

High gate count allows for the implementation of complex logic circuits

Large number of I/Os supports broad connectivity with external devices

Adequate internal RAM supports demanding data processing tasks

Low supply voltage contributes to reduced power consumption

Wide operating temperature range enhances deployment flexibility in different environments

Key Technical Parameters

Number of Gates: 1,124,022

Number of LABs/CLBs: 6,144

Number of Logic Elements/Cells: 27,648

Total RAM Bits: 131,072

Number of I/O: 404

Voltage Supply: 2.375V ~ 2.625V

Operating Temperature: 0°C ~ 85°C (TJ)

Package / Case: 560-LBGA Exposed Pad, Metal

Supplier Device Package: 560-MBGA (42.5x42.5)

Quality and Safety Features

Designed and manufactured by Xilinx, a leader in FPGA technology, ensuring high reliability and performance

Compliant with industry-standard quality and safety specifications for embedded applications

Compatibility

Compatibility with a wide range of design tools and development software from Xilinx, facilitating easy integration into existing projects

Application Areas

Telecom infrastructure

High-performance computing systems

Industrial control systems

Aerospace and defense electronics

Medical imaging equipment

Product Lifecycle

Obsolete status indicates that the product is no longer being manufactured by Xilinx and may have limited availability

Potential buyers should explore replacement or upgrade options within Xilinx's current product lines for newer technology or extended support

Several Key Reasons to Choose This Product

High logic and I/O capacity for advanced embedded systems design

Versatile RAM and logic resources support complex applications requiring intensive data processing

Low operating voltage and wide temperature range enhance suitability for a variety of operating environments

Made by Xilinx, ensuring access to top-tier development tools and support from a leader in FPGA technology

Despite its obsolescence, its powerful features continue to make it relevant for specialized applications where newer models may not be necessary or compatible

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XCV1000-5BG560C

Product Attribute XCV1000-5BG560C XCV1000-4BG560C XCV100-6BG256C XCV1000-5BG560I
Part Number XCV1000-5BG560C XCV1000-4BG560C XCV100-6BG256C XCV1000-5BG560I
Manufacturer AMD AMD AMD AMD
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ)
Total RAM Bits 131072 131072 40960 131072
Number of Gates 1124022 1124022 108904 1124022
Package / Case 560-LBGA Exposed Pad, Metal 560-LBGA Exposed Pad, Metal 256-BBGA 560-LBGA Exposed Pad, Metal
Voltage - Supply 2.375V ~ 2.625V 2.375V ~ 2.625V 2.375V ~ 2.625V 2.375V ~ 2.625V
Number of LABs/CLBs 6144 6144 600 6144
Package Tray Tray Tray Tray
Number of Logic Elements/Cells 27648 27648 2700 27648
Series Virtex® Virtex® Virtex® Virtex®
Number of I/O 404 404 180 404
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Base Product Number XCV1000 XCV1000 XCV100 XCV1000
Supplier Device Package 560-MBGA (42.5x42.5) 560-MBGA (42.5x42.5) 256-PBGA (27x27) 560-MBGA (42.5x42.5)

XCV1000-5BG560C Datasheet PDF

Download XCV1000-5BG560C pdf datasheets and AMD documentation for XCV1000-5BG560C - AMD.

Datasheets
Virtex 2.5 V.pdf
Environmental Information
Xilinx REACH211 Cert.pdf
PCN Obsolescence/ EOL
Spartan,Virtex FPGA/SCD 18/Oct/2010.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

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Certifications & Memberships

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AMD

XCV1000-5BG560C

AMD
32D-XCV1000-5BG560C

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