Manufacturer Part Number
XC7Z045-2FFG900E
Manufacturer
xilinx
Introduction
The XC7Z045-2FFG900E is an advanced Embedded System On Chip (SoC) that combines the software programmability of a Dual ARM® Cortex®-A9 MPCore™ processor with the hardware programmability of Xilinx's Kintex™-7 FPGA.
Product Features and Performance
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ technology for efficient multitasking.
Integrated Kintex™-7 FPGA with 350K logic cells for customizable hardware acceleration.
Versatile connectivity options including CANbus, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.
High-speed operation up to 800MHz.
Supports 256KB RAM for efficient processing.
Package includes 130 I/Os for extensive external interfacing.
Product Advantages
High integration of MCU and FPGA technologies reduces system complexity and BOM cost.
Broad range of connectivity options enhances system versatility and compatibility.
High-speed operation and generous logic cell count enable complex, high-performance computing tasks.
Effective for multitasking with dual-core ARM Cortex-A9 processors.
Key Technical Parameters
Core Processor: Dual ARM® Cortex®-A9 MPCore™
RAM Size: 256KB
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
Number of I/O: 130
Quality and Safety Features
Operates within a wide temperature range of 0°C to 100°C, ensuring reliability in varying environmental conditions.
Compatibility
Flexible connectivity options ensure compatibility with a vast range of peripheral devices and systems.
Application Areas
Telecommunications
Automotive systems
Industrial automation
Aerospace and defense
High-performance computing platforms
Product Lifecycle
Status: Active
This product is not nearing discontinuation, ensuring long-term availability and support for future projects.
Several Key Reasons to Choose This Product
Powerful combination of Dual ARM® Cortex®-A9 processor and Kintex™-7 FPGA for enhanced performance and flexibility.
High connectivity options and I/O count facilitates easy integration into a variety of systems.
Supports demanding applications with its high-speed operation and robust temperature range.
Long product lifecycle and active status ensure support and availability for future developments.
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