XC7Z030-1FBG676C - AMD

Manufacturer Part Number

XC7Z030-1FBG676C

Manufacturer

Xilinx

Introduction

XC7Z030-1FBG676C is an embedded System on Chip (SoC) from the Zynq®-7000 series, designed to offer high-speed, advanced processing for embedded applications.

Product Features and Performance

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Kintex™-7 FPGA with 125K Logic Cells

667MHz clock speed

130 I/O pins

Product Advantages

High integration of MCU and FPGA architecture enhances performance and flexibility.

Features dual-core processing for parallel and advanced computation tasks.

Offers extensive connectivity including Ethernet, USB OTG, and CANbus.

Key Technical Parameters

Core Processor: Dual ARM® Cortex®-A9

Flash Size: not available

RAM Size: 256KB

Speed: 667MHz

Connectivity: CANbus, Ethernet, USB OTG

Operating Temperature: 0°C ~ 85°C (TJ)

Quality and Safety Features

Built-in DMA for efficient data handling and reduced CPU load.

Robust temperature range for varied environmental conditions.

Compatibility

Supports multiple communication protocols, making it suitable for a wide range of peripheral integrations.

Application Areas

Industrial automation

Automotive

Telecommunications

Defense and aerospace

Product Lifecycle

Currently listed as active with no indication of discontinuation soon.

Replacements or upgrades should be considered as per future announcements from Xilinx.

Several Key Reasons to Choose This Product

Combines powerful dual-core ARM Cortex processors with high-capacity Kintex-7 FPGA.

Operates efficiently under a broad temperature range, suitable for harsh operating environments.

Versatile connectivity options cater to a wide range of engineering needs.

Ideal for high-demand applications requiring intensive processing and high-speed data transfer.