XC7Z010-1CLG400I - AMD

Manufacturer Part Number

XC7Z010-1CLG400I

Manufacturer

Xilinx

Introduction

Embedded System-On-Chip (SoC) integrating MCU and FPGA functionalities

Product Features and Performance

Dual ARM Cortex-A9 MPCore with CoreSight

Artix-7 FPGA with 28K Logic Cells

667MHz processor speed for high performance computing

Integrated peripherals for enhanced functionality

High connectivity with CANbus, EBI/EMI, Ethernet, I2C, and more

256KB on-chip RAM for efficient data handling

Product Advantages

High integration reduces complexity and BOM costs

Lower power consumption due to advanced manufacturing

Reliable system operation in extreme conditions from -40°C to 100°C

Robust ARM processors coupled with flexible FPGA fabric

Scalable from prototype to production

Key Technical Parameters

Core Processor: Dual ARM Cortex-A9 MPCore

Operating Temperature Range: -40°C to 100°C

Connectivity Options: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Flash Size: Not applicable

RAM Size: 256KB

Speed: 667MHz

Number of I/O: 130

Primary Attributes: Artix-7 FPGA, 28K Logic Cells

Package / Case: 400-LFBGA, CSPBGA

Supplier Device Package: 400-CSPBGA (17x17)

Quality and Safety Features

Built-in error correction and security features

Long-term reliability for industrial applications

Qualified to operate within industrial temperature ranges

Compatibility

Support for multiple industrial communication protocols

Compatible with various software stacks for embedded development

Easily interfaced with a wide range of peripheral devices

Application Areas

Industrial automation

Automotive systems

Consumer electronics

Medical devices

Telecommunications

Product Lifecycle

Currently active with ongoing manufacturer support

No indication of near discontinuation

Replacements or upgrades available within the Zynq-7000 series

Several Key Reasons to Choose This Product

Integration of ARM processing and FPGA for maximum flexibility

High-speed operation at 667MHz for demanding applications

Low power consumption coupled with high-temperature resilience

Comprehensive connectivity enabling vast application scope

Active product lifecycle and reliable manufacturer support

Robust package suitable for sophisticated and rugged designs