Manufacturer Part Number
XC7K410T-1FBG900I
Manufacturer
Xilinx
Introduction
High-performance FPGA designed for advanced embedded systems integration and applications
Product Features and Performance
High logic cell count for complex designs
Substantial RAM for processing and buffering
Abundant I/O for connectivity
Fine-grain power optimization capabilities
Support for advanced DSP processing
Multi-Gigabit Transceivers for high-speed communications
Product Advantages
Optimized for high signal processing bandwidth
Enhanced system performance with high logic cell density
Balanced power consumption and thermal management
Robust for industrial applications with extended temperature range
Large user I/O capacity for versatile interfacing
Key Technical Parameters
Number of LABs/CLBs: 31775
Number of Logic Elements/Cells: 406720
Total RAM Bits: 29306880
Number of I/O: 500
Voltage - Supply: 0.97V ~ 1.03V
Operating Temperature: -40°C ~ 100°C (TJ)
Quality and Safety Features
Extended temperature range for reliability in harsh environments
Robust surface mount packaging for secure assembly
Compatibility
Standard FCBGA package for compatibility with existing PCB designs
Compliant with multiple communication and interface standards
Application Areas
Advanced digital signal processing
High-speed networking equipment
Aerospace and defense systems
Telecommunications infrastructure
Industrial automation and control systems
Product Lifecycle
Active status with ongoing manufacturer support
No indication of nearing discontinuation
Upgrade paths available with newer Kintex® series or alternative Xilinx series
Several Key Reasons to Choose This Product
Superior performance-to-cost ratio for mid-range applications
Suitable for applications demanding high-speed DSP and signal processing
Ability to handle intricate digital designs with its extensive logic elements and memory
Scalable and forward-compatible design options within the Kintex®-7 family
Proven track record of quality and reliability backed by Xilinx
Good fit for applications with challenging environmental conditions due to sturdy build and temperature resilience