Manufacturer Part Number
XC7K325T-3FBG676E
Manufacturer
AMD Xilinx
Introduction
High-performance, power-efficient FPGA (Field Programmable Gate Array) for embedded systems and industrial applications
Product Features and Performance
326,080 logic elements/cells
16,404,480 total RAM bits
25,475 number of LABs/CLBs
Operating temperature range of 0°C to 100°C
Product Advantages
Reconfigurable and flexible design for customized hardware
High logic density and embedded memory for complex applications
Wide operating temperature range for industrial and harsh environments
Key Technical Parameters
Package: 676-FCBGA (27x27)
Mounting type: Surface mount
Supply voltage: 0.97V to 1.03V
Quality and Safety Features
RoHS3 compliant
Compatibility
Compatible with Kintex-7 FPGA series
Application Areas
Embedded systems
Industrial control and automation
Test and measurement equipment
Military and aerospace applications
Product Lifecycle
Current product, no plans for discontinuation
Replacement or upgrade options available within the Kintex-7 FPGA series
Key Reasons to Choose This Product
High logic capacity and embedded memory for complex designs
Wide operating temperature range for industrial applications
Reconfigurable and flexible design for customized hardware
RoHS3 compliance for environmental safety
Compatibility with the Kintex-7 FPGA series for design continuity