Manufacturer Part Number
XC7K325T-2FBG676C
Manufacturer
Xilinx
Introduction
Kintex®-7 FPGA for high-performance applications in signal processing and data communication
Product Features and Performance
High logic capacity with 326,080 Logic Elements/Cells
Integrated DSP slices for efficient processing
Large on-chip memory with 16,404,480 total RAM bits
High number of I/O ports, up to 400 for versatile connectivity
Low voltage operation from 0.97V to 1.03V for power efficiency
Surface Mount technology for high-density board designs
Product Advantages
High signal processing bandwidth for advanced systems
Cost-effective solution with optimized power, performance, and area
Multiple high-speed transceivers for serial connectivity
Flexible logic architecture to handle complex algorithms
Key Technical Parameters
Number of LABs/CLBs: 25475
Total RAM Bits: 16404480
Voltage - Supply: 0.97V ~ 1.03V
Number of I/O: 400
Quality and Safety Features
Robust thermal performance with operating temperature range from 0°C ~ 85°C
Compatibility
Compatible with FCBGA mounting techniques
Fits standard 676-BBGA, FCBGA footprint
Application Areas
Telecommunications infrastructure
Data center computing
Medical imaging
Industrial automation
Aerospace and defense systems
Product Lifecycle
Active product with support and resources available
Not reported nearing discontinuation at knowledge cutoff
Several Key Reasons to Choose This Product
Robust Kintex®-7 architecture targeted for performance at low costs
Scalable solution with a wide range of device choices to match design requirements
Extensive design tools and community support from Xilinx
Long-term availability for extended lifecycle applications
Strong ecosystem of IP and partner solutions for rapid development
XC7K325T-2FF900CXILINX