XC7K325T-1FBG676I - AMD

Manufacturer Part Number

XC7K325T-1FBG676I

Manufacturer

Xilinx

Introduction

High-performance FPGA part of the Kintex®-7 Family designed for advanced systems

Product Features and Performance

Array of programmable logic for customization

Low power consumption with maximum efficiency

Rich selection of built-in system-level blocks

Support for high-speed serial connectivity and advanced DSP

Optimized for logic, digital signal processing, and high-speed serial connectivity

Product Advantages

High ratio of performance to cost

Flexibility in system design with extensive I/O and logic configurability

Enhanced system integration capabilities

Adequate for both high-volume production and prototyping

Key Technical Parameters

Number of LABs/CLBs: 25475

Number of Logic Elements/Cells: 326080

Total RAM Bits: 16404480

Number of I/O: 400

Voltage - Supply: 0.97V ~ 1.03V

Quality and Safety Features

Robust operating temperature range of -40°C ~ 100°C (TJ)

Supported by comprehensive design tools for development

Strict compliance to industry quality and safety standards

Compatibility

Compatible with a range of development and design tools from Xilinx

Suitable for integration in various circuit topologies

Application Areas

High-speed digital signal processing

Telecommunications infrastructure

Networking equipment

Industrial automation

Medical imaging

Product Lifecycle

Active product status

Broad adoption in the market ensuring long-term availability

Consult Xilinx for future product lifecycle updates

Reasons to Choose This Product

Offers a balanced blend of cost, performance, and power efficiency

Adaptable to wide-ranging technological requirements due to its large number of logic cells and I/O ports

Industrial-grade temperature tolerance increases system reliability

Large onboard memory capacity catering to data-intensive applications

The product line is actively supported and unlikely to face discontinuation in the near future

Comes in a surface mount package that allows for high-density board design