Manufacturer Part Number
XC7K160T-3FBG676E
Manufacturer
Xilinx
Introduction
The XC7K160T-3FBG676E is part of the Kintex®-7 series from Xilinx, designed for high-performance applications requiring efficient logic, DSP, and IO bandwidth utilization.
Product Features and Performance
162,240 logic cells for versatile digital circuit design
12,975 K logic blocks for advanced logic implementation
11,980,800 total RAM bits for extensive data storage and manipulation
400 I/O pins for extensive external interfacing
Supports voltage supply from 0.97V to 1.03V for energy efficiency
Surface Mount technology for compact and reliable PCB design
Operating temperature range from 0°C to 100°C, catering to a wide array of environmental conditions
Encapsulated in a 676-BBGA, FCBGA package for high-density board integration
Product Advantages
High logic cell count enables complex digital system design within a single FPGA
Integrated DSP slices support efficient signal processing
Advanced IO capabilities allow for flexible interfacing with a wide range of peripherals
Low power consumption enhances system design sustainability
Key Technical Parameters
Total Logic Elements/Cells: 162,240
Number of LABs/CLBs: 12,675
Total RAM Bits: 11,980,800
Number of I/O: 400
Voltage Supply: 0.97V ~ 1.03V
Operating Temperature: 0°C ~ 100°C
Quality and Safety Features
Robust construction ensuring long-term reliability under varying environmental conditions
Compliance with industry-standard quality and safety regulations
Compatibility
Compatible with a wide range of development tools and software from Xilinx and third parties
Supports implementation in a diverse array of system designs due to versatile IO and logic features
Application Areas
High-performance computing
Signal processing
Embedded systems
Industrial control
Networking and telecommunications
Product Lifecycle
The product is in active status, ensuring ongoing manufacturing and availability
Not currently nearing discontinuation, with support and replacements readily available
Several Key Reasons to Choose This Product
High logic density and DSP capability enable advanced digital systems design
Energy-efficient operation reduces overall system power requirements
Wide operational temperature range provides reliability in varied environments
High IO count and flexible interfacing options facilitate complex peripheral integration
Supported by Xilinx’s comprehensive development ecosystem for accelerated design cycles
XC7K160T-3FFG676CAMD Xilinx